The FRT MicroProf® FE is our standard tool for automated 2D/3D wafer metrology. It combines the capabilities of the worldwide established MicroProf® 300 with a wafer handling system within an Equipment Front End Module (EFEM) and is equipped with filter units (FFU) to ensure the ISO Class 3 clean room conditions.
The handling unit has a single-arm robot with a vacuum end effector or an edge gripper, two load ports including mapper and RFID reader, pre-aligner etc. The MicroProf® FE is designed for the fully automated measurement with 300 mm FOUPs/FOSBs. In addition, the tool can be configured for processing open cassettes (150 mm/200 mm). It can also be configured exclusively for 200 mm or 300 mm wafers or as a 200 mm/300 mm bridge tool. In addition to the standard configuration, the tool can be equipped with numerous additional functions, which can also be retrofitted at a later date. Handling can also be performed for non-standard wafers, e.g. highly warped wafers (e.g. eWLB), or thin wafers down to 50 μm thickness. Likewise, further sensors can be retrofitted at a later stage because of the multi-sensor concept.
Some applications are shown here as examples. Typical strengths of the MicroProf® FE lie in the measurement of bare as well as structured and coated wafers in the various lithographic process steps. These include, for example, the measurement of step heights, bumps, vias (TSVs), trenches, etc. A further area is the layer thickness determination of thin films or layer stacks.
Thanks to its fully SEMI-compliant measurement solutions, almost maintenance-free hardware components and high throughput, the MicroProf® FE is the perfect workhorse in any front-end HVM-Fab. You can always keep up with the progressive development of technology with reduced investment costs.
We certainly have a solution for your specific task. Do not hesitate to contact us with any questions. Our experts will be happy to take care of your needs and work out individual solutions for you.