The MicroProf® family is growing: The MicroProf® TL
The FRT MicroProf® TL is the newest member of the MicroProf® series. Like any other MicroProf®, the ‘TL’ (thermal load) is an optical surface measuring tool for fully automatic 3D surface measurements for a wide range of applications. PCB design and simulation, 3D ICs, MEMS, stacked wafers and failure analysis are just some of the main applications.
The special feature of the MicroProf® TL is its thermal unit with a fully integrated heating and cooling chamber. The temperature range extends from 10° C to -80° C (liquid nitrogen cooling) up to 400° C with a fast heating and cooling rate and a homogeneous temperature distribution on the sample surface.
In addition to topography measurements, the system can be extended by the microDAC® TL, which incorporates a 2D deformation sensor from CWM. With the high-precision camera setup, global and local deformation fields can be measured with accuracy down to 50 nm. In this way, the lateral and vertical deformation of the specimens can be characterized under thermal load. This can be used to determine the behavior of components under working conditions, as well as to simulate different process steps.
In combination with the FRT Acquire Automation XT software, the MicroProf® TL can perform fully automatic temperature profiles. The user can set target temperatures, temperature ramps, and dwell times during the process. Set points can also be defined during which topography and deformation measurements take place in the heating/cooling process. A permanent temperature logging is available, optionally a second temperature probe can be added to monitor the temperature at specific locations on the sample.
The MicroProf® TL is based entirely on the well proven technology of the MicroProf® series.
You always know who is putting today: the MicroProf® MHU
For many industrial applications it is necessary to perform measurements fully automatically with high throughput rates. For this purpose an automatic handling of the samples is necessary. The FRT MicroProf® MHU is specially designed for the semiconductor, MEMS and LED industry and can be easily configured for various sample (wafer) types. The handling unit has a robot arm with two vacuum end effectors, a loading station for open cassettes including mapper, as well as optional OCR reader, pre-aligner etc. It is capable of processing wafer sizes from 2 to 12 inches. Depending on the configuration, up to 4 cassettes can be processed. Throughput rates of up to 200 wafers per hour are achieved. The tool can be equipped with numerous additional functions. Based on the multi-sensor concept, additional sensors can be retrofitted at a later date.
Some applications are shown here as examples. Typical strengths of the MicroProf® MHU lie in the measurement of bare wafers as well as structured and coated wafers in the various lithographic process steps. Of course there is also the option for two-sided sample measurement which allows for the simultaneous measurement of top and bottom surfaces and thus the determination of the sample thickness. The total thickness variation (TTV) of the sample can be measured together with surface parameters such as roughness, waviness and flatness of both sides. A complete wafer shape measurement is also possible, with analysis of the global and local wafer parameters. A sorting function is available for the sorting of good and bad samples. A further area of the MicroProf® MHU is the layer thickness determination of thin films, as well as layer stacks. Further applications are, for example, the measurement of step heights, bumps, vias (TSV), trenches, etc.
Due to its fully SEMI-compliant design, almost maintenance-free hardware components and its high throughput, the MicroProf® MHU is the perfect solution to significantly reduce the effort required for quality assurance.
The twin brother: The MicroProf® FE
The FRT MicroProf® FE is our standard tool for automated 2D/3D wafer metrology. It combines the capabilities of the worldwide established MicroProf® 300 with a wafer handling system within an Equipment Front End Module (EFEM) and is equipped with filter units (FFU) to ensure the ISO Class 3 clean-room conditions.
The handling unit has a single-arm robot with a vacuum end effector or an edge gripper, two load ports including mapper and RFID reader, pre-aligner etc. The MicroProf® FE is designed for the fully automated measurement with 300 mm FOUPs/FOSBs. In addition, the tool can be configured for processing open cassettes (150 mm/200 mm). It can also be configured exclusively for 200 mm or 300 mm wafers or as a 200 mm/300 mm bridge tool. In addition to the standard configuration, the tool can be equipped with numerous additional functions, which can also be retrofitted at a later date. Handling can also be performed for non-standard wafers, e.g. highly warped wafers (e.g. eWLB), or thin wafers down to 50 μm thickness. Likewise, further sensors can be retrofitted at a later stage because of the multi-sensor concept.
Some applications are shown here as examples. Typical strengths of the MicroProf® FE lie in the measurement of bare as well as structured and coated wafers in the various lithographic process steps. These include, for example, the measurement of step heights, bumps, vias (TSVs), trenches, etc. A further area is the layer thickness determination of thin films or layer stacks.
Thanks to its fully SEMI-compliant measurement solutions, almost maintenance-free hardware components and high throughput, the MicroProf® FE is the perfect workhorse in any front-end HVM-Fab. You can always keep up with the progressive development of technology with reduced investment costs.
The first Metrology Tuesday in the new look with the MicroProf® FS
The FRT MicroProf® FS is a fully automatic device for wafer metrology, which can be adapted to many applications.
Flexibility and versatility are key words when it comes to metrology solutions for the manufacturing process and the processing of silicon wafers. The MicroProf® FS follows a modular approach to provide a fully automated multi-sensor tool that can solve all the necessary measurement applications. Some are shown here as examples. Typical strengths of the MicroProf® FS lie in the measurement of structured wafers as well as coated wafers in the various lithographic process steps. These include, for example, the measurement of step heights, bumps, vias (TSVs), trenches, etc. A further area is the determination of the layer thickness of thin films or layer stacks.
Flexibility is also a priority for automation. The integrated handling robot can be configured for 300 mm, 200 mm and 150 mm wafers, the two load ports can be uniformly configured for a wafer size or as a bridge tool for two different wafer sizes within the system. In addition, the handling unit can also be used for handling non-standard wafers, e.g. highly warped wafers (e.g. eWLB) or thin wafers down to 50 μm thickness. The handling unit has a single-arm robot with a vacuum end effector or an edge gripper, two load ports including mapper and RFID reader, pre-aligner etc. The MicroProf® FS is equipped with filter fan units (FFU) that ensure ISO Class 3 clean room conditions within the tool. Thanks to its great versatility, the MicroProf® FS is a true all-rounder in any modern MEMS Fab or Foundry.
You may already know our Metrology Tuesday on Twitter and LinkedIn. Here you can find out more about the published topics and our offers. We want to give you an insight into the applications and measurement methods of our 3D surface measuring tools. Every week, you will get new examples of interesting metrology applications from a wide range of industries – we certainly have a solution for your specific application. Do not hesitate to contact us with any questions. Our team will be happy to take care of your needs and work out individual solutions for you.
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